Sidewall-free cesl for enlarging ild gap-fill window

ABSTRACT

An integrated circuit structure includes a first gate strip; a gate spacer on a sidewall of the first gate strip; and a contact etch stop layer (CESL) having a bottom portion lower than a top surface of the gate spacer, wherein a portion of a sidewall of the gate spacer has no CESL formed thereon.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is related to copending U.S. patent application Ser.No. 13/912,449, entitled “Sidewall-Free CESL for Enlarging ILD Gap-FillWindow,” filed on Jun. 7, 2013, with this application being acontinuation of, and the copending '449 application being a divisionalof, U.S. application Ser. No. 12/750,485, entitled “Sidewall-Free CESLfor Enlarging ILD Gap-Fill Window,” filed on Mar. 30, 2010, and U.S.Provisional Application No. 61/186,954 filed on Jun. 15, 2009, entitled“Sidewall-Free CESL for Enlarging ILD Gap-Fill Window,” whichapplications are hereby incorporated herein by reference.

TECHNICAL FIELD

This invention relates generally to integrated circuits, and moreparticularly to the gap-filling of inter-layer dielectrics (ILDs) in themanufacturing of integrated circuits.

BACKGROUND

Replacement gates are widely used in the manufacturing of integratedcircuits. In the formation of replacement gates, polysilicon gates areformed first, and replaced by metal gates in subsequent process steps.With the using of replacement gates, the gates of PMOS and NMOS devicescan have band-edge work functions, so that their performance can beoptimized.

The replacement gates typically have great heights, and hence the aspectratios of the gaps between gate stacks are also high. For example, FIG.1 illustrates gate polys 102 and 104 adjacent to each other. Gap 106 isthus formed between gate polys 102 and 104. After the formation of gatepolys 102 and 104, contact etch stop layer (CESL) 108 may be formed. Theformation of CESL 108 adversely results in an increase in the aspectratio of gap 106.

Referring to FIG. 2, inter-layer dielectric (ILD) 110, often referred toas ILD0, is formed to fill gap 106. In subsequent process steps, gatepolys 102 and 104 may be replaced with metal gates. Currently,high-density plasma (HDP) processes are widely used for the ILD0 gapfilling process. However, the gap filling capability of HDP is notsatisfactory, and hence void 112 may be formed in gap 106. If formedusing advanced technologies such as 22 nm or 20 nm technologies, theaspect ratio of gap 106 is particularly high. What is needed, therefore,is a method and structure for overcoming the above-describedshortcomings in the prior art.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIGS. 1 and 2 illustrate cross-sectional views of intermediate stages ina conventional manufacturing process of an integrated circuit structure;and

FIGS. 3A through 9 are cross-sectional views and top views ofintermediate stages in the manufacturing of an integrated circuitstructure in accordance with an embodiment.

DETAILED DESCRIPTION

The making and using of the embodiments of the present invention arediscussed in detail below. It should be appreciated, however, that theembodiments provide many applicable inventive concepts that can beembodied in a wide variety of specific contexts. The specificembodiments discussed are merely illustrative of specific ways to makeand use the invention, and do not limit the scope of the invention.

A novel integrated circuit structure and a method of forming the sameare provided. The intermediate stages of manufacturing an embodiment areillustrated. The variations of the embodiment are then discussed.Throughout the various views and illustrative embodiments, likereference numbers are used to designate like elements.

FIG. 3A illustrates a cross-sectional view of an integrated circuitstructure. Substrate 10 is provided. Substrate 10 may be formed ofcommonly known semiconductor materials such as silicon, silicongermanium, gallium arsenide, and the like. First gate stack 21 andsecond gate stack 41 are formed on substrate 10. First gate stack 21includes gate dielectric 20, gate strip 22, and optional hard mask layer24. Gate spacers 26 are formed on sidewalls of gate stack 21. Secondgate stack 41 includes gate dielectric 40, gate strip 42, and optionalhard mask layer 44. Gate spacers 46 are formed on sidewalls of gatestack 41. Gate spacers 26 and 46 are adjacent to each other with gap 34therebetween.

In an embodiment, gate strips 22 and 42 are formed of polysilicon. Inother embodiments, gate strips 22 and 42 are formed of other conductivematerials such as metals, metal silicides, metal nitrides, and the like.A common source or a common drain 30 (referred to as a source/drainhereinafter) may be located in substrate 10 and between gate stacks 21and 41. Source/drain regions 36 and 48 may be formed adjacent to gatestacks 21 and 41, respectively. Further, silicide regions 32 may beformed on source/drain regions 30, 36, and 48. Gate stack 21 andsource/drain regions 30 and 36 form a first MOS device, and gate stack41 and source/drain regions 30 and 48 form a second MOS device.

FIG. 3B illustrates an alternative embodiment, wherein gate (poly)strips 22 and 42 are formed directly over shallow trench isolation (STI)region 50. Also, the structure shown in FIG. 3B may be the extension ofthe structure shown in FIG. 3A. A top view of the structure shown inFIGS. 3A and 3B is illustrated in FIG. 3C.

FIG. 4 illustrates the formation of contact etch stop layer (CESL) 52,which may be formed of commonly used CESL materials including, but notlimited to, SiN_(x), SiO_(x), SiON, SiC, SiCN, BN, SiBN, SiCBN, andcombinations thereof. In an embodiment, CESL 52 is formed using plasmaenhanced chemical vapor deposition (PECVD), although other methods suchas sub atmospheric chemical vapor deposition (SACVD), low pressurechemical vapor deposition (LPCVD), atomic layer deposition (ALD),high-density plasma (HDP), plasma enhanced atomic layer deposition(PEALD), molecular layer deposition (MLD), plasma impulse chemical vapordeposition (PICVD), and the like can also be used.

In an embodiment, CESL 52 includes top portions 52-1, sidewall portions52-2, and bottom portions 52-3. Top portion 52-1 is located on the topof hard mask layers 24 and 44. Sidewall portions 52-2 are located on thesidewalls of gate spacers 26 and 46. The bottom portions 52-3 are at thebottom of gap 34 and on silicide regions 32. Sidewall portions 52-2 havedifferent characteristics from top portions 52-1 and bottom portions52-3. In an embodiment, sidewall portions 52-2 have a density lowerthan, for example, about 80% percent, of the densities of top portions52-1 and bottom portions 52-3.

An exemplary formation process of CESL 52 is performed using PECVD. ThePECVD for forming CESL 52 may include generating plasma using alow-frequency energy source that provides a low-frequency energy,wherein the frequency of the low-frequency energy may be lower thanabout 900 KHz. An exemplary low frequency is about 350 KHz. Further, forgenerating the plasma, a high-frequency energy source is also used toprovide a high-frequency energy. The frequency of the high-frequencyenergy may be greater than about 900 KHz. An exemplary high frequency is13.56 MHz. Throughout the description, the power provided through thelow-frequency energy source is referred to as a low-frequency power,while the power provided through the high-frequency energy source isreferred to as a high-frequency power. The high-frequency power and thelow-frequency power may be provided simultaneously in the formation ofCESL 52. It is observed that the low-frequency power has the effect ofbombarding CESL 52, resulting in a greater density of the horizontalportions (top portions 52-1 and bottom portions 52-3) of CESL 52, whilesidewall portions 52-2 are affected less by the bombardment, and hencehave a lower density than that of top portions 52-1 and bottom portions52-3. The low-frequency power may be increased relative to thehigh-frequency power to increase the densifying effect of top portions52-1 and bottom portions 52-3. In the embodiment wherein both thehigh-frequency energy and the low-frequency energy are provided, a ratioof the high-frequency power to the low-frequency power may be lower thanabout 1, lower than about 0.8, or even lower than about 0.1.

Next, an isotropic etch is performed to remove sidewall portions 52-2 ofCESL 52, while top portions 52-1 and bottom portions 52-3 are notremoved. In an embodiment in which CESL 52 is formed of silicon nitride,the isotropic etch may be a wet etch using phosphoric acid. Sincesidewall portions 52-2 have a lower density, they have a greater etchingrate than that of top portions 52-1 and bottom portions 52-3. In theisotropic etch, top portions 52-1 and bottom portions 52-3 will also bereduced. However, the isotropic etch may be controlled so that at leastsome of top portion 52-1 and bottom portion 52-3 remain. FIG. 5Aillustrates one embodiment wherein the remaining bottom portions 52-3are spaced apart from spacers 26 and/or 46. FIG. 5B illustrates anotherembodiment, wherein remaining bottom portions 52-3 are in contact withspacers 26 and/or 46. The resulting top portions 52-1 may have athickness greater than the thickness of bottom portions 52-3.

As a result of the removal of sidewall portions 52-2 of CESL 52, theaspect ratio (the ratio of height H to width W; refer to FIG. 5A) of gap34 is reduced, and hence the possibility of forming voids in thesubsequent gap-filling process is reduced. FIG. 6 illustrates thefilling of inter-layer dielectric (ILD) 60, which is also referred to asILD0 since an additional ILD will be formed thereon. ILD 60 may beformed of commonly used CESL materials including, but not limited to,SiN_(x), SiO_(x), SiON, SiC, SiBN, SiCBN, and combinations thereof. Inan embodiment, ILD 60 is formed using HDP, although other methods suchas SACVD, LPCVD, ALD, PEALD, PECVD, MLD, PICVD, spin-on, and the likemay also be used.

Referring to FIG. 7, a chemical mechanical polish (CMP) may be performedto remove hard mask layers 24 and 44 and top portions 52-1. Inalternative embodiments, the CMP may be performed using hard mask layers24 and 44 as CMP stop layers. Next, gate dielectrics 20 and 40 and gatestrips 22 and 42 are replaced by gate dielectrics 60 and 70 and metalgates 62 and 72. The formation processes are known in the art, and henceare not repeated herein. As a result, the gate stacks shown in FIG. 3Bwill also be replaced by gate dielectrics 60 and 70 and metal gates 62and 72.

In subsequent process steps, as shown in FIG. 8, an additional ILD 74,also known as ILD1, is formed over ILD 60. The process is then continuedby forming contact openings in ILDs 74 and 60 and filling the contactopenings to form contact plugs 76. In the formation of the contactopenings, bottom portions 52-3 of CESL 52 are used to stop the etching.

In alternative embodiments, as shown in FIG. 9, mask layers 24 and 44(refer to FIG. 3A) are not formed, or are formed but removed before theformation of silicide regions. Gate silicides 68 and 78 may be formed ontop of gate strips 22 and 42, respectively. In these embodiments, gatedielectrics 20 and 40 and gate strips 22 and 42 may not be replaced bygate dielectrics 60 and 70 and metal gates 62 and 72. Accordingly, topportions 52-1 of CESL 52 are used to stop etching in the formation ofcontact plugs 76 that are connected to gate silicides 68 and 78.

In accordance with one aspect of the embodiment, a method of forming anintegrated circuit structure includes providing the integrated circuitstructure having a first gate strip and a gate spacer on a sidewall ofthe first gate strip. A contact etch stop layer (CESL) is formed. TheCESL includes a top portion directly over the first gate strip and abottom portion lower than the top portion. The top portion and thebottom portion are spaced apart from each other by a space. A portion ofa sidewall of the gate spacer facing the space has no CESL formedthereon.

In accordance with another aspect of the embodiment, an integratedcircuit structure is provided. The integrated circuit structure includesa first gate strip; a gate spacer on a sidewall of the first gate strip;and a contact etch stop layer (CESL) having a bottom portion lower thana top surface of the gate spacer, wherein a portion of a sidewall of thegate spacer has no CESL formed thereon.

The embodiments of the present invention have several advantageousfeatures. By removing sidewall portions of CESL 52, the aspect ratios ofthe gaps between adjoining gate spacers are reduced. Therefore, the gapfilling is less likely to incur voids. This is particularly beneficialfor MOS devices formed using the gate-last approach due to therelatively great height of the gate stacks.

According to an embodiment, an integrated circuit structure comprises afirst conductive strip, a first spacer on a sidewall of the firstconductive strip, a second conductive strip and a second spacer on asidewall of the second conductive strip. A gap is between the firstspacer and the second spacer. The structure further has a contact etchstop layer (CESL) comprising a top portion directly over the firstconductive strip and a bottom portion in the gap and disconnected fromthe top portion, wherein a sidewall of the first spacer does not haveany portion of the CESL formed thereon.

An integrated circuit structure according to an embodiment comprises afirst gate strip on a substrate, a first spacer on a sidewall of thefirst gate strip, a second gate strip on the substrate and a secondspacer on a sidewall of the second gate strip. A gap is between thefirst spacer and the second spacer. A contact etch stop layer (CESL) isdisposed on the substrate between the first spacer and the second spacerand comprises a bottom portion lower than a top surface of the firstspacer. A top surface of the bottom portion of the CESL is higher than abottom surface of the first spacer and a bottom surface of the secondspacer. A portion of a sidewall of the first spacer has no CESL formedthereon.

Other embodiments are also disclosed.

The advantageous features of the embodiments include a reduced aspectratio of the gap between gate strips. As a result, it is easier to fillthe gaps between the gate strips without causing voids.

Although the present invention and its advantages have been described indetail, it should be understood that various changes, substitutions andalterations can be made herein without departing from the spirit andscope of the invention as defined by the appended claims. Moreover, thescope of the present application is not intended to be limited to theparticular embodiments of the process, machine, manufacture, andcomposition of matter, means, methods and steps described in thespecification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present invention. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, or steps. In addition, eachclaim constitutes a separate embodiment, and the combination of variousclaims and embodiments are within the scope of the invention.

What is claimed is:
 1. A method comprising: providing a first gate stripover a substrate and having a gate spacer on a sidewall of the firstgate strip; forming a contact etch stop layer (CESL) over the gate stripand on a first sidewall of the gate spacer, a second sidewall of thegate spacer is opposite the first sidewall of the gate spacer andnearest the first gate strip, wherein a top portion of the CESL extendsover the gate strip and a bottom portion of the CESL extends over thesubstrate, and wherein a sidewall portion of the CESL is disposed on thefirst sidewall of the gate spacer; etching the CESL and removing atleast a sidewall portion of the CESL on a first sidewall of the gatespacer; and forming an inter-layer dielectric (ILD) over and contactingthe CESL; wherein the CESL comprises a material having a high etchselectivity with respect to the ILD; wherein, after the etching, thebottom portion of the CESL is lower than a top surface of the gatespacer; and wherein, after the etching, a top surface of the bottomportion of the CESL is higher than a bottom surface of the gate spacer.2. The method of claim 1, wherein the forming the CESL comprises using adeposition process with a low frequency energy to form the CESL, whereinthe low frequency energy has a frequency lower than about 900 kHz. 3.The method of claim 1, wherein the forming the CESL comprises using adeposition process with a high frequency energy and a low frequencyenergy to form the CESL, wherein the high frequency energy has afrequency higher than about 900 kHz and the low frequency source has afrequency of about 350 kHz or lower.
 4. The method of claim 3, whereinthe ratio of a power of the high-frequency energy to a power of thelow-frequency energy is lower than about
 1. 5. The method of claim 1,further comprising providing a second gate strip adjacent the first gatestrip with a gap between the first gate strip and the second gate strip,wherein the bottom portion of the CESL is in the gap.
 6. The method ofclaim 1, wherein after the etching the CESL, the bottom portion of theCESL adjoins the gate spacer.
 7. The method of claim 1, wherein afterthe etching the CESL, the bottom portion of the CESL is spaced apartfrom the gate spacer.
 8. The method of claim 1, wherein the etching theCESL further forms a top portion of the CESL aligned directly over thefirst gate strip and disconnected from the bottom portion of the CESLafter the etching, and wherein the bottom portion of the CESL is thinnerthan the top portion of the CESL.
 9. A method, comprising: providing afirst conductive strip and a second conductive strip on a substrate;forming a first spacer on a first sidewall of the first conductivestrip; forming a second spacer on a second sidewall of the secondconductive strip, the first sidewall facing the second sidewall and thefirst spacer separated from the second spacer by a gap; forming acontact etch stop layer (CESL) over the first conductive strip andextending over the substrate in the gap; modifying the CESL such that atop portion and a bottom portion are separated and disconnected, the topportion directly over the first conductive strip, and the bottom portionin the gap; and forming an inter-layer dielectric (ILD) over andcontacting at least the bottom portion of the CESL.
 10. The method ofclaim 9, wherein the forming the CESL comprises using a depositionprocess with a low frequency energy source to form the CESL, wherein thelow frequency source has a frequency lower than about 900 kHz, andwherein, after the forming the CESL, a sidewall portion of the CESLdisposed between the top portion and the bottom portion has a lowerdensity than a density of the top portion and the bottom portion of theCESL.
 11. The method of claim 10, wherein the modifying the CESLcomprises etching the CESL with an isotropic etch and removing thesidewall portion of the CESL, and wherein, after the etching, the topportion has a thickness greater than a thickness of the bottom portion.12. The method of claim 9, wherein the forming the CESL comprises usinga deposition process with a high frequency energy and a low frequencyenergy to form the CESL, wherein the low frequency energy has afrequency of about 350 kHz or lower.
 13. The method of claim 12, whereinthe ratio of a power of the high-frequency energy to a power of thelow-frequency energy is lower than about
 1. 14. The method of claim 9,wherein, after the modifying the CESL, the bottom portion of the CESL isin contact with the first spacer and the second spacer.
 15. The methodof claim 9, wherein modifying the CESL comprises removing a portion ofthe CESL such that the bottom portion of the CESL is separated and pacedapart from the first spacer and the second spacer.
 16. The method ofclaim 15, wherein forming the ILD comprises further comprising aninter-layer dielectric (ILD) in the gap and extending between the firstspacer and the bottom portion of the CESL, the CESL contacting thesubstrate between the first spacer and the bottom portion of the CESL.17. A method, comprising: forming a first gate strip on a substrate;forming a gate spacer on a sidewall of the first gate strip, the gatespacer having a first sidewall opposite a second sidewall, the secondsidewall of the gate spacer nearest the first gate strip; forming acontact etch stop layer (CESL) over the gate strip and extending overthe first sidewall of the gate spacer and over the substrate adjacent tothe gate strip; removing a sidewall CESL portion from the first sidewallof the gate spacer and forming a top CESL portion separate and spacedapart from a bottom CESL portion; and forming an inter-layer dielectric(ILD) over and contacting the CESL; wherein, after removing a sidewallportion of the CESL, a top surface of the bottom CESL portion is higherthan a bottom surface of the gate spacer.
 18. The method of claim 17,wherein the forming the CESL comprises using a deposition process with alow frequency energy to form the CESL having the sidewall CESL portionwith a lower density than the top CESL portion and the bottom CESLportion.
 19. The method of claim 18, wherein the low frequency sourcehas a frequency of about 350 kHz or lower.
 20. The method of claim 17,wherein the forming the CESL comprises using a deposition process with ahigh frequency energy and a low frequency energy to form the CESL,wherein the low frequency source has a frequency of about 900 kHz orlower, and wherein the ratio of a power of the high frequency energy toa power of the low frequency energy is lower than about 0.8.